High-Bandwidth Memory Chips : hbm3e 12h
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The HBM3E 12H is expected to be an optimal solution for future systems that require more memory, especially for artificial intelligence (AI) and high-performance computing (HPC) applications. Samsung estimates that its 12-Hi HBM3E 36 GB modules can increase the average speed for AI training by 34% and expand the number of simultaneous users of inference services by more than 11.5 times. Samsung has already begun providing samples of the HBM3E 12H to customers, with mass production scheduled to commence in the first half of this year. However, the company has not disclosed the pricing or availability of the new memory products yet.
Image Credit: Samsung
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