Innovative RAM-Cooling Solder Masks : ddr5 cooling technology
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rephrase this content to 3000 words 
The essence of this technological advancement lies in its ability to integrate heat conduction, radiation, and insulation into a singular optimized solder mask. This not only provides insulation but also enhances heat dissipation and conduction, resulting in a remarkable 8.5°C temperature reduction during real-world testing. Such a feat is particularly crucial as the industry strides towards the AI computing era, where speed and performance are paramount, yet often at odds with thermal efficiency. ADATA’s pioneering solution, which will be featured in their upcoming LANCER NEON RGB and LANCER RGB series, is a testament to their commitment to innovation and excellence in the face of rising performance demands.
Image Credit: ADATA
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